• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for producing a security element which has optically active security features, characterized by the following method steps: a) provision of a carrier substrate b) application of a radiation-curable embossing lacquer layer c) introduction of nanostructures into at least a first partial area simultaneously with the introduction of microchannels in at least d) curing the radiation-curable lacquer layer e) applying a lift-off lacquer layer which can be dissolved in a solvent or in water, this lacquer layer exclusively filling (wetting and) the microchannels. f) application of a reflection layer, g) removal of the lacquer layer soluble in a solvent or water by the action of a solvent or water h) optionally applying a further functional layer or a protective lacquer layer
    公开号:AT520011A1
    申请号:T205/2017
    申请日:2017-05-16
    公开日:2018-12-15
    发明作者:Dieter Nees Dr；Barbara Stadlober Dr；Stephan Trassl Dr；Sonja Landertshamer Dr
    申请人:Hueck Folien Gmbh；
    IPC主号:
    专利说明:

    The invention relates to a security element for data carriers, such as documents of value and the like, which has optically active properties, and to a method for its production.
    Data carriers, such as documents of value and the like, are provided with security elements to protect against counterfeiting and to check authenticity. Data carriers in the sense of the present invention are understood to mean in particular documents of value such as banknotes, certificates, shares, identification documents such as passports and the like.
    Optically active elements are often used as security elements. For the purposes of the present application, optically active elements are understood to mean, in particular, diffraction structures, such as holograms, holographic grating images, surface reliefs and the like. These optically active elements are generally created by embossing a lacquer layer and combined with a reflection layer.
    These optically active structures show different images from different viewing angles. Such viewing angle-dependent effects cannot be imitated with normal printing techniques.
    To increase the security against counterfeiting, partial recesses are provided in such security elements, especially in the reflection layer of the optically active structures. These recesses can be in the form of letters, numbers, symbols, characters, logos, geometric shapes and the like and are generally created subsequently, for example by washing processes or etching techniques.
    However, it can also be advantageous to provide the cutouts as see-through areas between the optically active structures. It is particularly advantageous to provide these viewing areas as precisely as possible outside the optically active structures, the reflection layer then being to be present only in the area of the optically active structure.
    In any case, a register-exact agreement between the optically active structure and the reflection layer without tolerances is particularly desirable in order to ensure excellent security against forgery.
    WO 2006/084685 A discloses a method for producing a multilayer body and a multilayer body produced by this method.
    In the case of a multilayer body with a partially shaped first layer, it is provided that in a first region of a replication layer of the multilayer body a first diffractive relief structure with a high depth-to-width ratio of the individual structural elements, in particular with a depth-to-width ratio of> 0.3, is molded. This first layer is applied to the replication layer in the first region and in a second region, in which the first relief structure is not shaped in the replication layer, with a constant surface density, based on a plane spanned by the replication layer. The structural elements, which have a high depth-to-width ratio, in particular of> 0.3, are designed as mountains and valleys, i.e. the valleys extend into the replication lacquer layer, the mountains protrude beyond the plane spanned by the replication lacquer layer. The diffractive relief structure in this first area increases the surface of the replication lacquer layer compared to the second area in which the relief structure is not present. When a layer is applied, in this case a metallic reflection layer with a constant surface density, the thickness of the first layer assumes a predetermined value, whereas the thickness of the first layer in the second region is significantly less. This difference in thickness is used for the removal of the first layer or a layer located thereon, so that the first layer and optionally a further layer located on this first layer can be selectively removed.
    A security element is known from WO 2006/079489 A, in which a reflection layer is provided, into which individual markings in the form of patterns, letters, numbers or images are introduced by the action of laser beams. The reflection layer has a first partial area with an interference structure and a second partial area. The two sub-areas interact differently with the laser radiation, so that the individual markings can be visually recognized due to a change in the optical properties of the reflection layer caused by the action of the laser beam, at least one of the two sub-areas.
    A security element and a method for its production are known from EP 2 444 826 A, in which a reflective layer applied to an optically active structure is selectively provided with a masking layer. The reflective layer in the unmasked porous regions is then selectively removed by contacting it with a reactive gas or a reactive liquid.
    The object of the invention was to provide a security element and a method for its production, in which an exact register-based correspondence of the optically active structure with the reflection layer is ensured.
    The invention therefore relates to a method for producing a security element which has optically active security features, characterized by the following method steps:
    a) Providing a carrier substrate
    b) applying a radiation-curable embossing lacquer layer to the carrier substrate / 23
    4:
    c) introducing nanostructures into at least a first partial area simultaneously with introducing microchannels into at least a second partial area of the radiation-curable lacquer layer,
    d) curing the radiation-curable lacquer layer
    e) Application of a lift-off lacquer layer which is soluble in a solvent or in water, this lacquer layer exclusively wetting and filling the microchannels.
    f) applying a reflective layer,
    g) removing the paint layer which is soluble in a solvent or water by the action of a solvent or water
    h) if necessary, applying a further functional layer or a protective lacquer layer.
    The carrier substrates are, for example, carrier films, preferably flexible plastic films, for example made of PI, PP, MOPP, PE, PPS, PEEK, PEK, PEI, PSU, PAEK, LCP, PEN, PBT, PET, PA, PC, COC, POM, ABS, PVC , PTFE, ETFE (ethylene tetrafluoroethylene), PTFE (polytetra-fluorethylene), PVF (polyvinyl fluoride), PVDF (polyvinylidene fluoride), and EFEP (ethylene tetrafluoroethylene hexafluoropropylene fluoropolymer).
    The carrier films preferably have a thickness of 5 to 700 μm, preferably 5 200 μm, particularly preferably 5 to 50 μm.
    A radiation-curable embossing lacquer layer is applied to the carrier substrate.
    The radiation-curable embossing lacquer layer preferably has a high surface energy.
    Nanostructures are introduced into this embossing lacquer layer in at least a first region and microchannels are introduced in at least a second region. These nanostructures and microchannels are preferably introduced simultaneously in one operation. Embossing processes are suitable for introducing the nanostructures and microchannels, in which the / 23
    Embossing tool is preferably designed in such a way that both the nanostructures and the microchannels are introduced into the radiation-curable embossing lacquer layer in one operation.
    Nanostructures are understood here to mean structures with a small depth, which essentially represent optically active diffraction structures, such as holograms, surface reliefs and the like.
    The nanostructures usually have a depth and a width of in each case <2 pm, preferably 20-500 nm, particularly preferably 200-500 nm. The depth to width ratio is approximately 1: 3 to 1: 0.3, preferably 1: 2 - 1: 0.5, particularly preferably approximately 1: 1.
    Microchannels are understood here to mean structures which have a depth of 2 100 pm, preferably 3 to 20 pm and a width of 2 to 100 pm. The depth to width ratio is 1: 1 to 10: 1, preferably 2: 1 to 5: 1. The microchannels have a geometry that tapers to the depth, for example a V-shaped geometry or a geometry with convex edges.
    The ratio of the nanostructures to the microchannels is 1: 4 to 1: 5000, preferably 1: 6 to 1: 100.
    After the embossing lacquer layer has hardened, preferably under UV radiation, a lift-off lacquer layer which is soluble in a solvent, for example in an organic solvent or in water, is applied.
    The embossing lacquer layer must be matched to the lift-off lacquer layer applied after the nanostructures and microchannels have been introduced, so that only the microchannels are wetted and filled by the lift-off lacquer layer. The so-called wicking effect is used according to the invention.
    / 23 • ·
    For example, if the lift-off lacquer layer is a water-soluble lacquer layer, the embossed lacquer layer must have a high surface energy.
    The wicking effect, i.e. the spontaneous wetting and filling of a microchannel with a liquid (e.g. a lift-off lacquer), is based on an exact coordination of the surface energy of the embossing lacquer and the lift-off lacquer (characterized by the contact angle Θ that the lift Off lacquer on a smooth surface of the embossing lacquer) and the geometry of the microchannels (characterized by the opening angle α of a channel with a tapering cross-section tapering down, for example a channel with a V-shaped cross-sectionD described by the following formula:
    θ <φ = 90 ° -α / 2 I φ here is the edge angle of the side walls with the horizontal. Formula I is the so-called Concus-Finn relation (P. Concus and R. Finn: On a dass of capillary surfaces. J. Analyze Math. 23 (1970), 65-70.), Which describes that a liquid (here Lift -off lacquer) a V-shaped channel (in the embossing lacquer material) and only wet it spontaneously if the contact angle is smaller than the edge angle. For small channel opening angles, the Concus-Finn relation enables many channels to be completely unimpeded wetting the channel. The relation is also valid, for example, for a channel, the side walls of which are formed from two circular cylinders, as a result of which an opening angle of 0 ° - at the top - or at the bottom of the trench - is created.
    Formula II is also important to understand the wicking behavior on structured surfaces
    Here 0 c means the critical contact angle of the lift-off lacquer on a rough or structured embossing surface, which is geometrically determined and for wetting / 23
    or filling of a lift-of-F paint in the channels must be undercut. The critical contact angle is determined by the roughness factor r and the plateau area component Φ δ (proportion of the non-wetted area of the microchannels) (cf. FIG. 1a).
    If condition II is met, hemi-wicking occurs, i.e. only the channels are filled, while the plateau surfaces remain dry.
    The roughness factor is the quotient of the true surface and its horizontal projection, as described, for example, in Dinesh Chandra et al., "Dynamics of a droplet imbibing on a rough surface", Langmuir 2011, 27, 13401-13405.
    The plateau area fraction Φ β represents the proportion of the non-wetted area of the microchannels. According to the invention, this is minimized (Φ δ ~ 0) in order to achieve a completely selective wetting of the microchannels in the area of the microchannels.
    By utilizing the wicking effect, the embossing lacquer layer is only wetted by the lift-off lacquer in the area of the microchannels, in the area of the flat nanostructures there is no wetting due to the build-up of the lift-off lacquer.
    The larger the critical angle 0c, i.e. the larger the roughness factor according to the above formula and the smaller the proportion of plateau area of the microchannels Φ δ , the more freedom of design there is with the surface energy of the embossing lacquer (see FIG. 1).
    Only if Condition I and Condition II are met does a complete spontaneous and exclusive wetting or filling of microchannels (with a non-rectangular cross-section) by a lift-off lacquer, the plateau surfaces (with flat nanostructures) remain unwetted.
    / 23
    Particularly suitable UV-crosslinkable embossing lacquer compositions are, for example, embossing lacquers based on polyethylene glycol diacrylates (PEGDA), optionally with 1-50% by mass of higher-functional acrylates, such as trimethylolpropane triacrylate (TMPTA) or pentaerythritol tetraacrylate (PETTA) or mixtures of acryloylmorpholine (ACMO) with 10 - 50% by mass of higher functional acrylates, such as trimethylolpropane triacrylate (TMPTA) or pentaerythritol tetraacrylate (PETTA).
    Further suitable embossing lacquer compositions are, for example, lacquer compositions based on a polyester, an epoxy or polyurethane system which contain two or more different photoinitiators which are known to the person skilled in the art and which can initiate curing of the lacquer system to different extents at different wavelengths.
    These embossing lacquer compositions are polar or hydrophilic and show high surface energies of up to 60 mN / m.
    The embossing lacquer compositions contain 0.5-5% photoinitiators, which bring about crosslinking when treated with UV radiation or electron beams. Particularly suitable photoinitiators are, for example, photoinitiators based on acylphosphine oxides, such as Iragure 819®, Genocure TPO®, Genocure BAPO® or oligomeric polyfunctional alpha hydroxy ketones such as Esacure KIP 150®, monomeric alpha hydroxy ketones such as Esacure KL 200®, Genocure DMHA® or Darocure 1173 ®. Mixtures of these photoinitiators can also be used.
    Particularly suitable lift-off lacquer compositions are, for example, hydroxyethylcaprolactone acrylate such as HECLA® from BASF or Miramer M100® from Miwon, ethoxyethoxyethyl acrylate such as Miramer M170® from Miwon or EDGA® from BASF, 2-ethoxyethylacrylate such as Viscoat 190® from Kowa, tetrahydrofurfamerla50ylate such as Mir from Miwon or Sartomer 302®, Viscoat 150®, gamma-butylolactone acrylate such as GBLA® from Kowa, 4Acryloylmorpholin such as ACMO® from Rahn or Luna ACMO® from DKSH, / 23 • · · · ·· ··
    Hydroxypropyl acrylate such as HPA® from BASF, isobornyl acrylate such as IBOA® from Allnex or IBXA® from Kowa.
    These lift-off lacquer compositions contain 0.5-5% of photoinitiators, such as photoinitiators based on acylphosphine oxides, such as Iragure 819®, Genocure TPO®, Genocure BAPO® or oligomeric polyfunctional alpha hydroxy ketones such as Esacure KIP 150®, monomeric alpha hydroxy ketones, like Esacure KL 200®, Genocure DMHA® or Darocure 1173®. Mixtures of these photoinitiators can also be used.
    Due to its low surface tension and thus a low contact angle, isobornyl acrylate can also be used in conjunction with embossing lacquers with lower surface energy, such as polyurethane acrylate-based embossing lacquers.
    After the lift-off coating composition has been applied, it is polymerized using an electron beam or UV radiation.
    Alternatively, thermal drying or physically curing lacquer compositions based on MMA or ethyl cellulose or cycloolefin copolymer can also be used.
    The lift-off lacquer layer can also only be printed in the area of the microchannels, any register fluctuations are compensated for by wetting the microchannels.
    A reflective layer, preferably a metallic reflective layer, is then applied to the lift-off lacquer layer. The metallic reflection layer is preferably deposited by PVD or CVD processes, for example by thermal evaporation, by sputtering or electron beam evaporation. Suitable metallic reflection layers are, for example, layers made of Al, Sn, Cu, Zn, Pt, Pd, Au, Ag, Cr, Ti, Ni, Mo, Fe or their alloys, such as e.g. Cu-Al, Cu-Sn, Cu10 / 23 • • 9 *
    1 $ «* · ί ·» »· 9 • ···» · · · · «« »· ·· ···· ··· • · · ··
    Zn, iron alloys, steel, stainless steel, metal compounds such as oxides or sulfides of metals such as copper oxide, aluminum oxide, zinc sulfide and the like.
    In the subsequent process step, the lift-off lacquer layer is removed by the action of an organic solvent or water at the same time as the metallic reflection layer above it.
    The metallic reflection layer only remains on the embossing lacquer layer in the area of the nanostructures, since the lift-off lacquer layer was only in the areas of the microchannels.
    This results in an exact match of the nanostructures with the metallic reflection layer without tolerances.
    The structure obtained in this way can then optionally be provided with one or more protective lacquer layers or further functional layers. The refractive index of the layer adjacent to the embossing lacquer layer must be matched to the refractive index of the embossing lacquer layer in order to prevent optical interactions with the microchannels.
    In the method according to the invention, a defined, locally limited wetting of different lacquers on a film surface is achieved by targeted pre-structuring by means of an embossing process. In combination with subsequent coating in a vacuum (e.g. sputtering, vapor deposition) and lift-off, this leads to the production of a self-adjusted, locally limited coating.
    In particular, this enables the self-aligned and selective coating of surfaces with sufficiently flat nanostructures by functional layers made of metals, metal oxides, semiconductors or CVD polymers.
    FIGS. 2a to 2e show the process sequence for producing the security element according to the invention.
    / 23: ικ:
    Where:
    the nanostructures the microchannels the embossing lacquer layer the lift-off lacquer layer the reflection layer another layer the carrier substrate
    2a shows the surface structuring of the embossing lacquer layer 3 applied to a carrier substrate 7 with the nanostructures 1 and the microchannels 2.
    In this case, the nanostructures 1 represent, for example, a hologram embossing, for example with a depth of 200-500 nm and a width of 200-500 nm.
    The microchannels have a V-shaped cross section and, depending on the thickness of the lacquer layer, have a depth of 3 to 30 pm and an opening width of 1 to 15 pm. The microchannels are introduced into the plane spanned by the lacquer layer, but do not extend beyond the plane spanned by the lacquer layer.
    2 b shows the distribution of the lift-off lacquer 4 applied in the next method step in the microchannels 2, the surface of the nanostructures not being wetted by the lift-off lacquer layer 4 due to the wicking effect.
    2 c, a full-surface reflective metallic layer 5 was applied to the embossing lacquer layer 3 and the lift-off lacquer layer 4. This metallic layer can optionally also already be partially applied, at least the nanostructures 1 and in some cases the adjacent microchannels having to be provided with the metallic reflection layer 5.
    / 23
    • · · ·· · · ·······
    In FIG. 2 d, the lift-off lacquer layer was removed together with the reflection layer 5 located above this lacquer layer 4 by the action of a solvent or water, the detachment optionally being supported by mechanical action or ultrasound.
    The metallic reflection layer 5 is now absolutely congruent with the area of the nanostructures 1 on the embossing lacquer layer 3.
    2 e shows the security element after application of a further layer 6, which can be a protective lacquer layer or a further functional layer with a security feature.
    The security element can optionally have further full-surface or partial functional layers, such as electrically conductive layers, magnetic layers and / or layers with optical features, such as colored printing layers, luminescent (fluorescent or phosphorescent) printing layers, layers which have a color change or color shift effect.
    Furthermore, the security element can be provided on one or both sides with one or more protective lacquer layers and / or adhesive layers.
    The security elements produced according to the invention are therefore, if appropriate, suitable as security features in data carriers, in particular value documents such as ID cards, cards, banknotes or labels, seals and the like, but also on packaging material, for example in the pharmaceutical, electronics and / or food industry, for example on blister films, Folding boxes, covers, foil packaging and the like are suitable.
    For use as security features, the substrates or film materials are preferably cut into strips or threads or patches, the width of the strips or threads preferably being 0.05-10 mm / 23: i3 ::
    can and the patches preferably average widths or lengths of 0.3-20 mm.
    For use in or on packaging, the film material is preferably cut into strips, tapes, threads or patches, the width of the threads, strips or tapes preferably being 0.05-50 mm and the patches preferably having average widths and lengths of 2- 30 mm.
    / 23
    Examples:
    Example 1:
    Embossing lacquer:
    m-% PEGDA (MW = 600 g / mol corresponding to approximately n = 10) 17 m-% TMPTA 3 m-% KL200
    Lift-off lacquer or “wash color”:
    Water soluble:
    m-% ACMO m-% KL200
    Process parameters application, embossing etc
    Example 2:
    % ACMO 47% TMPTA 3% KL200
    Lift-off lacquer
    Water soluble: 97 m% ACMO 3 m% KL200 / 23 iS
    Example 3:
    Embossing lacquer:
    m% trifunctional UA oligomer e.g. Ebecryl 4820® 47% hexanediol diacrylate (HDDA)% KL200
    Lift-off lacquer:
    m-% IBOA m-% KL200
    权利要求:
    Claims (15)
    [1]
    claims:
    1) Method for producing a security element which has optically active security features, characterized by the following method steps:
    a) Providing a carrier substrate
    b) applying a radiation-curable embossing lacquer layer to the carrier substrate
    c) introducing nanostructures into at least a first partial region and introducing microchannels into at least a second partial region of the radiation-curable lacquer layer,
    d) curing the radiation-curable lacquer layer
    e) applying a lift-off lacquer layer which is soluble in a solvent or in water, this lacquer layer exclusively wetting and filling the microchannels,
    f) applying a reflective layer,
    g) removing the paint layer which is soluble in a solvent or water by the action of a solvent or water together with the overlying reflection layer.
    h) optionally applying one or more further functional layer (s) or protective lacquer layer (s).
    [2]
    2) Method according to claim 1, characterized in that in step c) the nanostructures in a first region and the microchannels in a second region of the radiation-curable lacquer layer are introduced simultaneously in one operation.
    [3]
    3) Method according to one of claims 1 or 2, characterized in that as embossing lacquer UV-crosslinkable embossing lacquer compositions based on polyethylene glycol diacrylates (PEGDA), optionally with 1 -10% by mass
    17/23 • ·········· higher functional acrylates, such as trimethylolpropane triacrylate (TMPTA) or pentaerythritol tetraacrylate (PETTA) or mixtures of acryloylmorpholine (ACMO) with 10-50 mass% of higher functional acrylates, such as trimethylolpropane triacrylate (TMPTA) or Pentaerythritol tetraacrylate (PETTA), or coating systems based on a polyester, an epoxy or polyurethane system which contains two or more different photoinitiators known to the person skilled in the art, which can initiate curing of the coating system to different degrees at different wavelengths.
    [4]
    4) Method according to one of claims 1 to 2, characterized in that the lift-off resist Hydroxyethylcaprolactonacrylat, ethoxyethoxyethyl acrylate, 2-ethoxyethyl acrylate, tetrahydrofurfuryl acrylate, gamma Butylolactonacrylat, acryloylmorpholine, hydroxypropyl acrylate or isobornyl acrylate or thermal drying or physically curable coating compositions based on MMA or Ethyl cellulose or cycloolefin copolymer can be used.
    [5]
    5) Method according to one of claims 1 to 4, characterized in that the embossing lacquer and the lift-off lacquer contain 0.5 - 5% photoinitiators.
    [6]
    6) Method according to one of claims 1 to 5, characterized in that the embossing lacquer and the lift-off lacquer contain photoinitiators based on acyl phosphine oxides, or oligomeric polyfunctional alpha hydroxy ketones or monomeric alpha hydroxy ketones.
    [7]
    7) Method according to one of claims 1 to 6, characterized in that the reflection layer made of metals such as Al, Sn, Cu, Zn, Pt, Pd, Au, Ag, Cr, Ti, Ni, Mo, Fe or their alloys, such as Cu-Al, Cu-Sn, CuZn, iron alloys, steel, stainless steel, metal compounds such as oxides
    18/23 lfj or sulfides of metals, such as copper oxide, aluminum oxide, zinc sulfide.
    [8]
    8) Method according to one of claims 1 to 7, characterized in that the reflection layer is deposited by a PVD or CVD method, for example by thermal evaporation, by sputtering or electron beam evaporation.
    [9]
    9) Method according to one of claims 1 to 8, characterized in that the depth-to-width ratio of the nanostructures is 1: 3 to 1: 0.3.
    [10]
    10) Method according to one of claims 1 to 9, characterized in that the depth-to-width ratio of the microchannels is 1: 1 to 10: 1.
    [11]
    11) Method according to one of claims 1 to 10, characterized in that the ratio of the depth of the nanostructures to the microchannels is 1: 4 to 1: 5000, but preferably 1: 6 to 1: 100.
    [12]
    12) Method according to one of claims 1 to 11, characterized in that the microchannels have a cross section tapering downwards.
    [13]
    13) Method according to claim 11, characterized in that the microchannels have a V-shaped cross section or a geometry with convex edges.
    [14]
    14) Method according to one of claims 1 to 13, characterized in that the security element is then provided with one or more functional layers and / or protective lacquer layers or adhesive layers.
    [15]
    15) Use of the security element produced according to one of claims 1 to 14 in or on data carriers, value documents, such as
    19/23 ·· ·· ·· ···· ·· ···· ······· ·· · f <f · ····· · · • · · · ··· ·
    ID cards, cards, banknotes or labels, seals, packaging materials, or products.
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    同族专利:
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    EP3403842A1|2018-11-21|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US4044177A|1976-03-25|1977-08-23|The Standard Products Company|Method of decorating an embossed plastic strip|
    EP0758587A1|1995-08-10|1997-02-19|Landis &amp; Gyr Technology Innovation AG|Method for fabricating partially metallized grid structrures|
    DE102005003958A1|2005-01-27|2006-08-03|Giesecke & Devrient Gmbh|Security element, especially for valuable document, has reflective layer with areas that interact differently with laser radiation so reflective layer optical characteristic modification of one area enables visual characteristic recognition|
    DE102005006231B4|2005-02-10|2007-09-20|Ovd Kinegram Ag|Method for producing a multilayer body|
    DE102006037431A1|2006-08-09|2008-04-17|Ovd Kinegram Ag|Production of multi-layer bodies useful in element for security- and value document such as banknotes and credit cards, by forming a relief structure in an area of replication layer and applying a layer on carrier and/or replication layer|
    DE102007055112A1|2007-01-05|2008-07-10|Giesecke & Devrient Gmbh|Producing safety foil for valuable document e.g. check, comprises printing a side of substrate with a printing ink in the form of characters to be produced, applying a coating on the printed side and removing the printing ink|
    DE102007061979A1|2007-12-21|2009-06-25|Giesecke & Devrient Gmbh|security element|
    CN102460236B|2009-06-18|2014-10-22|凸版印刷株式会社|Optical element and method for manufacturing same|
    CN104704401B|2012-11-19|2017-09-26|凸版印刷株式会社|Anti-counterfeit structure body and its manufacture method|AT523393B1|2020-04-06|2021-08-15|Hueck Folien Gmbh|Process for the production of a security element with a colored microstructure|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA205/2017A|AT520011B1|2017-05-16|2017-05-16|Method for producing a security element and security element produced by this method and its use|ATA205/2017A| AT520011B1|2017-05-16|2017-05-16|Method for producing a security element and security element produced by this method and its use|
    ES18000221T| ES2806409T3|2017-05-16|2018-03-07|Procedure to produce a security element, as well as its use|
    PL18000221T| PL3403842T3|2017-05-16|2018-03-07|Method for producing a security element and its use|
    EP18000221.4A| EP3403842B1|2017-05-16|2018-03-07|Method for producing a security element andits use|
    HUE18000221A| HUE049328T2|2017-05-16|2018-03-07|Method for producing a security element and its use|
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